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High-Performance Computing

High-Performance Computing
Cadence, Samsung bring AI to SoC, 3D-IC and chiplet design
Cadence, Samsung bring AI to SoC, 3D-IC and chiplet design
Business news |
Collaboration expanded with a new multi-year IP agreement and joint development of advanced AI-driven flows on the latest SF2P process…
HighPoint adaptors boost PCIe slots for GPU scalability
HighPoint adaptors boost PCIe slots for GPU scalability
New Products |
Adaptors significantly increase PCIe capacity without compromising signal integrity or bandwidth for AI and ADAS.
Codasip to design EU-funded RISC-V processor
Codasip to design EU-funded RISC-V processor
Technology News |
With a European-based development team, Codasip will provide a customisable general-purpose RISC-V processor for the €240M initiative.
Mahindra and Vector Informatik deliver on SDV collaboration
Mahindra and Vector Informatik deliver on SDV collaboration
Business news |
Strategic collaboration involved building a future-ready SDV architecture for Electric Origin SUVs from Mahindra.

Accenture acquires AOX in software-defined vehicles push
Accenture acquires AOX in software-defined vehicles push
Business news |
The acquisition of embedded software company AOX in Germany will help automotive companies and their suppliers develop software-defined vehicles.
CXL memory module targets AI servers and data centers
CXL memory module targets AI servers and data centers
New Products |
The CXL memory module supports 32GB/s of bandwidth and supports data transfer speeds up to 32GT/s via the PCIe Gen5 x8 interface.
HiPEAC – Upstairs, Downstairs
HiPEAC – Upstairs, Downstairs
News |
The HiPEAC conference in Munich is full of surprises While ‘upstairs’ on the conference floor, the latest technologies on High Performance Computing are presented, ‘downstairs’ in the U-bahn, on the…
Computing system targets video plus AI plus 5G applications
Computing system targets video plus AI plus 5G applications
New Products |
Based on NVIDIA Jetson AGX Orin, the AI computing system suits harsh outdoor environments and supports multiple video inputs.
High-Rise and Elevators in CPU architecture
High-Rise and Elevators in CPU architecture
News |
New concepts explain the Future of Hardware Technologies for Computing In his keynote speech on the ‘Future of Hardware Technologies’ at the HiPEAC conference in Toulouse, Subhasish Mitra uses ‘high-rise’…
READY, SET, GO – HiPEAC Conference Toulouse 2023
READY, SET, GO – HiPEAC Conference Toulouse 2023
News |
HiPEAC RACE TRACKS – VISION 2023 The HiPEAC conference 2023 takes place in Toulouse and is presenting the participants with an ambitious Vision document. The document is putting the EU…
The new AMD MI300 will be a Game Changer
The new AMD MI300 will be a Game Changer
Interviews |
AI is changing the world of High Performance computing – Ivo Bolsens, Senior Vice President AMD The HiPEAC conference in Toulouse (Jan 16-18, 2023) is a great gathering of researchers,…
Samsung Electronics introduces fastest LPDDR5X DRAM at 8.5 Gbps
Samsung Electronics introduces fastest LPDDR5X DRAM at 8.5 Gbps
Technology News |
Samsung completes validation of LPDDR5X DRAM at operating speed of 8.5Gbps on Snapdragon mobile platforms, unlocking new markets for LPDDR memory.


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