Samsung denies HBM chips have failed Nvidia tests.
Samsung Electronics has denied reports that its high-bandwidth memory (HBM) products have failed to meet Nvidia quality standards, according to Business Korea.
Reuters had previously reported that Samsung’s HBM chips were failing stringent Nvidia tests due to power consumption and heat issues.
HBM DRAM multi-die components are used with GPUs to address AI processing in server farms in data centers. The market is showing blistering growth and Nvidia holds about 80 percent of the market, according to reports.
Samsung has reportedly portrayed the situation as not being one of failure but of continuous optimization in partnership with customers.
Business Korea reported a statement from Samsung saying the company is “smoothly conducting tests for HBM supply with various global partners.” And that it is “continuously testing technology and performance in close cooperation with multiple companies.”
SK Hynix is the market leader in HBM and a battle is beginning to be fought about the latest iteration of the standard; HBM3E.
Related links and articles:
SK Hynix has ‘sold out’ of HBM DRAMs for 2024
Micron begins production of a ‘better’ HBM3E memory
SK Hynix begins volume production of ‘best’ HBM3E
Samsung goes 12-high with HBM3E 36Gbyte DRAM
HBM to be 20 percent of DRAM market in 2024
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