Mitsubishi Electric launches compact DIPIPM power semiconductor modules
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Mitsubishi Electric has introduced a new compact version of its DIPIPM (Dual Inline Package Intelligent Power Module) power semiconductor modules, designed for use in consumer and industrial equipment such as packaged air conditioners and heat pump systems. The new Compact DIPIPM lineup includes the PSS30SF1F6 (30A / 600V) and the PSS50SF1F6 (50A / 600V), with sample shipments starting September 22.
For eeNews Europe readers, the news is significant as it points to continued innovation in power semiconductors for energy-efficient inverter systems, particularly relevant for HVAC and industrial motor markets in Europe, where demand for compact, high-performance modules is growing.
Smaller footprint for energy-efficient designs
The new modules leverage Mitsubishi’s reverse-conducting insulated-gate bipolar transistors (RC-IGBTs), reducing the footprint to just 53% of the company’s Mini DIPIPM Ver.7 series. This smaller size enables more compact inverter substrates for air conditioners and heat pump systems, addressing industry needs for miniaturization and higher integration.
Mitsubishi says the modules will also be showcased at PCIM Asia 2025 in Shanghai later this month, highlighting their role in driving more efficient inverter solutions. Globally, inverter technology is increasingly deployed to cut power consumption in HVAC systems, which ties directly to carbon reduction goals.
Built for cold-climate adoption
Mitsubishi Electric has also focused on robustness for colder regions such as Northern Europe and North America. The compact DIPIPM modules operate continuously down to -40°C, ensuring stable performance in heat pump air conditioning systems even in low temperatures.
Other design highlights include a new interlock function for arm short-circuit protection, which simplifies circuit design, and equivalent insulation distances from terminals to the heat sink compared with conventional models, easing replacement in existing designs.
Continuing the DIPIPM legacy
Mitsubishi first commercialized its DIPIPM in 1997, integrating switching devices with control ICs in a transfer mold package. These modules have since become a staple in inverter-driven applications such as air conditioners, washing machines, heating systems, and industrial motors.
According to the company, the Compact DIPIPM series shrinks the footprint by about 47% compared to earlier products, contributing to the ongoing trend of downsizing inverter systems without sacrificing reliability. “Through the adoption of RC-IGBTs, Mitsubishi Electric has achieved a smaller module size, contributing to the compact design of inverter substrates,” the company stated in its release.
With demand rising for high-efficiency, compact power modules, Mitsubishi’s latest offering positions the company to address both industrial and consumer markets worldwide while supporting broader efforts toward energy savings and carbon neutrality.
https://www.mitsubishielectric.com/
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