Kulicke & Soffa joins Hi-CHIP, enables high-density RDL
Kulicke and Soffa Industries has announced that it has joined the Heterogeneous Integration and Chiplet System Package Alliance (Hi-CHIP), an initiative led by the Taiwan-based Industrial Technology Research Institute (ITRI), in collaboration with other major industry players. The Hi-CHIP alliance leverages advanced packaging competencies and the LITEQ 500 lithography process from Kulicke & Soffa, enabling high-density redistribution layers (RDL). High-density RDL is an enabler for high-density fan-out wafer-level packaging (FOWLP) and similar approaches which provide performance, thermal management, power consumption and form-factor improvements to broad applications supporting telecommunications, computing, automotive, and biomedical markets.
In addition to providing a market-ready solution for emerging heterogenous applications, high-density RDL is also utilized within many other fast-growing applications including Antenna-in-Package for 5G mmWave and sub-6 GHz RF modules; integrated systems for baseband and smartphone application processors; artificial intelligence integrated with RF and memory; and other transistor-dense applications such as System in Package. These emerging applications are anticipated to outpace semiconductor unit growth, driving demand for the company’s high-accuracy flip-chip, thermocompression and lithography systems, such as its LITEQ 500.
The LITEQ 500 lithography projection stepper uses a laser-based light source to provide high-intensity exposures without intensity degradation over time. This approach delivers high throughput, high uptime, long life, and low-cost of ownership. The single wavelength light source enables the use of high-transmission and low- aberrations optics, which makes it a compelling choice for high-density RDL applications.
With the support from the Department of Industrial Technology, Ministry of Economic Affairs, ITRI has been innovating semiconductor technologies and will continue to develop world-leading technologies, serving as a bellwether for the semiconductor industry.
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