EU, Japan agree to cooperate on ‘beyond-2nm’ chips, quantum
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The European Union and Japan have agreed to cooperate on a number of technology topics including chips and quantum technology in efforts to bolster both parties’ technology sovereignty.
The topics include semiconductor devices and processes beyond 2nm, chiplets and heterogeneous integration, AI, 5G and 6G communications and quantum technology.
The agreement was reached at the third digital partnership council meeting held in Tokyo, Japan on May 12. The meeting was chaired by Henna Virkkunen, executive vice-president for technology sovereignty at the European Commission. On 13 May, Virkkunen and the Japanese Minister responsible for science and technology policy, Minoru Kiuchi, will sign a Letter of Intent on quantum technology collaboration.
In joint statement reporting on the meeting, the EU and Japan said: “Both sides reaffirmed the increasing relevance of the Digital Partnership and the joint collaboration it stimulates in the context of geopolitical challenges. It contributes to setting the basis for strengthening mutual economic resilience and economic security, as well as upholding a rules-based international order.”
Europe and Japan are both former chip market leaders that have been eclipsed by the rise of chip manufacturing in Taiwan, South Korea and China.
Japan is attempting to develop a chip manufacturing capability at 2nm, which would be close the leading edge. Both Japan and Europe have persuaded the world’s chip manufacturing leader, TSMC, to build joint-venture wafer fabs locally. However, both are set to produce chips to meet demand behind the leading edge.
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