Avicena, TSMC optimise photodetector arrays for I/O interconnects
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Avicena will work with TSMC to optimise photodetector (PD) arrays for Avicena’s revolutionary LightBundle microLED-based interconnects.
LightBundle interconnects support over 1-Tbps/mm shoreline density and extend ultra-high-density die-to-die (D2D) connections to over 10 metres at class-leading sub-pJ/bit energy efficiency. This will enable AI scale-up networks to support large clusters of GPUs across multiple racks, eliminating the reach limitations of current copper interconnects while drastically reducing power consumption.
Increasingly sophisticated AI models are driving an unprecedented surge in demand for compute and memory performance, requiring interconnects with higher density, lower power, and longer reach for both processor-to-processor (P2P) and processor-to-memory (P2M) connectivity.
LightBundle has been developed specifically to address extreme I/O requirements of AI clusters with extremely high shoreline densities and ultra-low power consumption. Its transmitters use microLED arrays optimised for dense, high-speed interconnects achieving less than 1-pJ/bit energy efficiency. The optical receivers utilise silicon PD arrays optimised for the visible light wavelengths transmitted by the microLEDs. LightBundle chiplet transceivers are well-suited to various packaging architectures, including co-packaged optics (CPO), onboard optics (OBO), and pluggable optical modules. Both LED and PD arrays are bonded directly to the surface of CMOS ICs for a variety of process nodes. This work harnesses TSMC’s leadership in image and optic sensor technologies to produce high-performance PD arrays for visible light while also benefiting from TSMC’s manufacturing excellence.
“Avicena has been working with TSMC since our very beginning. TSMC’s world-class manufacturing capabilities and deep experience in silicon optical sensors are critical for developing and producing key components of our LightBundle interconnects,” says Bardia Pezeshki, co-founder and CEO of Avicena.
“Collaborating with innovators like Avicena to advance AI infrastructure addresses the growing demands for compute scalability through efficient connectivity,” said Lucas Tsai, Vice President of Business Management at TSMC North America. “TSMC provides the most comprehensive foundry CMOS image sensor (CIS) technology portfolio.”
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