Automotive MOSFET lineup expands with ROHM HPLF5060 package
ROHM has expanded its automotive MOSFET portfolio with 40V and 60V power devices for vehicle systems with a compact surface-mount package aimed at improving board-level robustness. The move reflects ongoing pressure on designers to shrink power stages without compromising reliability in harsh automotive environments.
For eeNews Europe readers working on inverter control, pumps or lighting modules, the packaging approach is potentially as relevant as the silicon itself, particularly where assembly yield and inspection are critical.
Smaller footprint, focus on board-mount reliability
The company has introduced automotive MOSFET devices in its HPLF5060 package, measuring 4.9mm × 6.0mm, as part of its low-voltage portfolio. These 40V and 60V components target applications such as main inverter control circuits, electric pumps and LED headlights.
While 5060-size and smaller packages are becoming more common in automotive designs, tighter terminal spacing and leadless formats can complicate mounting and inspection. ROHM positions the HPLF5060 as an alternative to the widely used TO-252 package, which measures 6.6mm × 10.0mm. By adopting gull-wing leads, the package is intended to enhance solder joint visibility and board-mount reliability while still reducing footprint.
The devices also use copper clip junction technology to support high-current operation in compact form factors. In practice, this could help designers balance current capability and thermal performance against PCB area constraints in 12V and 48V subsystems.
Mass production of products using the HPLF5060 package began in November 2025, with distribution through channels including DigiKey and Farnell.
Broader package roadmap for automotive MOSFETs
Beyond the HPLF5060, ROHM is preparing additional package options for its automotive MOSFET lineup. Mass production of a smaller DFN3333 package, measuring 3.3mm × 3.3mm and featuring wettable flank technology, is scheduled to begin around February 2026. Wettable flanks can support automated optical inspection, which remains a key requirement in automotive assembly lines.
At the higher-power end, development has started on a TOLG (TO-Leaded with Gull-wing) package sized at 9.9mm × 11.7mm. This indicates a parallel effort to address applications where higher current and mechanical robustness take precedence over miniaturisation.
The additions sit within ROHM’s EcoMOS silicon power MOSFET brand, which covers devices for automotive, industrial and appliance systems. As vehicle architectures continue to evolve, packaging strategy is likely to remain a differentiator, particularly where reliability, inspectability and thermal behaviour intersect.
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