Applied Materials takes stake in Dutch firm BESI
US chip manufacturing equipment maker Applied Materials has taken a 9 percent stake in BE Semiconductor Industries NV (Duiven, The Netherlands), a maker of advanced packaging equipment.
Applied did not disclose how much it has paid for its stake which may have been acquired over many years. Applied and BESI have been collaborating since 2020 on hybrid bonding technology. This allows direct copper-to-copper connections between chips, enabling higher interconnect density and shorter wiring between chiplets.
“We view this as a strategic, long-term investment that demonstrates Applied Materials’ commitment to co-developing the industry’s most capable hybrid bonding solution, a technology that is becoming increasingly important to the advanced logic and memory chips at the foundation of AI,” said Terry Lee, general manager of heterogeneous integration and packaging at Applied Materials, in a statement.
Applied said the investment was made through market-based transactions and is not subject to regulatory approvals. It says it does not intend to seek board representation at BESI and has no plans to purchase additional shares in the company.
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