AI sensor boom to drive $85.6B MEMS packaging market by 2030
The global MEMS packaging market is on track for sharp growth this decade, as demand for sensors continues to expand across consumer, automotive, industrial, and medical electronics. According to a new report from Valuates, the market is expected to rise from $48.08bn in 2024 to $85.64 billion by 2030.
For eeNews Europe readers, the story here is less about the headline number and more about what’s driving it: packaging is increasingly the bottleneck (and differentiator) for MEMS performance, reliability, and manufacturability. As AI-enabled sensing spreads into more products, packaging complexity is becoming a key competitive battleground.
Packaging is the MEMS performance enabler
Valuates highlights rising sensor integration in automotive and consumer electronics as the core demand driver. Vehicles increasingly rely on MEMS across safety and control functions, including airbags, electronic stability control, tire pressure monitoring, ultrasonic parking sensors, ADAS modules and cabin air quality systems. All such solutions require rugged, vibration-resistant, and often hermetically sealed packaging, according to the release.
In consumer devices, the push is toward tighter integration and smaller form factors. Smartphones, wearables, AR/VR headsets, and wireless earbuds now integrate multiple inertial sensors, pressure sensors and MEMS microphones, all squeezed into compact layouts. The report also points to growing MEMS usage in medical systems such as portable diagnostics, hearing aids, implantable pressure sensors, and drug delivery devices, where biocompatibility and long-term sealing are essential.
Inertial and ultrasonic sensors drive packaging innovation
The report breaks the market into four major packaging categories: inertial, optical, environmental and ultrasonic sensors. Among these, inertial and ultrasonic MEMS stand out for the way they stress packaging design.
Ultrasonic MEMS — which are used in automotive obstacle detection, robotics navigation, and industrial proximity sensing — require packaging that supports acoustic transmission while still protecting electronics from moisture, dust and vibration, according to the release. Inertial sensors depend on precise mechanical isolation and low-stress packaging to maintain accuracy.
A competitive field from foundries to sensor giants
Valuates lists a broad set of key players spanning packaging specialists, sensor leaders and foundry ecosystems. These include ChipMOS, AAC Technologies, Bosch Sensortec, Infineon, Analog Devices, Texas Instruments, TSMC, MEMSCAP, Orbotech (KLA) and TDK.
The projected 10.1% CAGR is a reminder that MEMS packaging is no longer a back-end afterthought. It is increasingly where cost, yield, reliability, and product differentiation collide, especially as sensor density rises in AI-enabled systems.
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